Analyst Day 2025: Fairly fairly and fairly massive too
Marvell was exhibiting off their packaging prowess at the latest Analyst Day. SemiAccurate noticed a reasonably superior glass package deal on the present and appreciated what we noticed
Glass packaging is nothing new, Intel was the primary to indicate it off publicly at Innovation in 2022, and has proven it a number of instances since. At their Foundry occasion in early 2025 they’d some fairly superior units on show however their self-defeating coverage on footage meant no publicity from SemiAccurate. Because the first exhibiting there was loads of discuss from different gamers on the tech as effectively, however Marvell was the primary to be what we think about open about issues.
Word the scale of the pen
In the event you take a look at the above image, the very first thing you see is the coarse weave of the tablecloth. Jokes apart, this can be a fairly large package deal, glass after all, with a declare of going so far as 14x reticle measurement. The package deal pictured above is nowhere that giant however it’s nonetheless a a number of of the present ~800mm^2 reticle measurement. Extra importantly it is vitally skinny, has excessive planarity, is straightforward to make TSVs by way of, and may be backlit with blinky LEDs identical to the underside of your automotive! That too was a joke however you may truly do it. Please don’t although.
Given the state of the package deal proven to us at Analyst Day, Marvell is fairly near placing glass packaging into manufacturing. In concept it ought to permit a lot bigger 2.5D/3D/3.5D packages with a lot tighter bump pitches. The planarity and floor smoothness over natural packages must also equate to larger yields and higher reliability however lets see the way it works out in follow. We’re hopeful on this entrance however as all the time, time will inform for everybody utilizing this tech.
From there the convenience of by way of creation, capacity to mount issues to the underside, and added potential for package deal cooling will permit for a lot higher flexibility in chiplet primarily based units. That is the great distance of claiming that Marvell is true there within the combine for the following technology of superior packaging, bridging the hole between natural packages and interposers. We will’t wait to see the units that come out of this tech.S|A
